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IPC 4761 : 0

Current
Current

The latest, up-to-date edition.

DESIGN GUIDE FOR PROTECTION OF PRINTED BOARD VIA STRUCTURES
Available format(s)

Hardcopy

Language(s)

English

Published date

01-07-2006

1 SCOPE
  1.1 Purpose
  1.2 Terms and Definitions
2 APPLICABLE DOCUMENTS
  2.1 IPC
3 PWB FABRICATION AND ASSEMBLY GUIDELINES
  3.1 Advantages of Via Protection
  3.2 PWB Fabrication Issues
      3.2.1 Fill or Plug Separation from Plated Hole
            Wall
      3.2.2 Voids
  3.3 Assembly Process Issues
  3.4 Long Term Reliability Concerns
4 MATERIALS/DESIGN CONSIDERATIONS
  4.1 End Use Considerations
  4.2 Fabrication Considerations
  4.3 Assembly Considerations
  4.4 Types of Materials for Filled/Plugged
      4.4.1 Non-conductive (Organic) - Non-imageable
      4.4.2 Non-conductive - Photoimageable
      4.4.3 Conductive Ink
  4.5 Materials for Tented/Covered Via Structures
      4.5.1 Tented Only
      4.5.2 Tented and Covered
  4.6 Material Specification and Selection
5 VIA PROTECTION DEFINITIONS AND TYPES
  5.1 Tented Via (Type I Via)
  5.2 Tented and Covered Via (Type II Via)
  5.3 Plugged Via (Type III Via)
  5.4 Plugged and Covered Via (Type IV Via)
  5.5 Filled Via (Type V Via)
  5.6 Filled and Covered Via (Type VI Via)
  5.7 Filled and Capped Via (Type VII Via)
  5.8 Partially Filled Via
6 PERFORMANCE TRADEOFFS
  6.1 Planarity
  6.2 Via Metallization
  6.3 Moisture Absorption
  6.4 Cleanliness Concerns
  6.5 Use of Conformal Coating
7 SAMPLE DESIGNS
8 EXAMPLES OF DRAWING NOTES

Provides PCB designers, manufacturers and uses with detailed information on all existing methods for protecting vias on printed boards, including all types of via tenting, plugging, filling and capping.

Committee
D-30
DevelopmentNote
Included in IPC C 106. Included in IPC C 105 & IPC C 1000. (07/2008)
DocumentType
Standard
Pages
22
PublisherName
Institute of Printed Circuits
Status
Current

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