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IPC 9201 : A

Current
Current

The latest, up-to-date edition.

SURFACE INSULATION RESISTANCE HANDBOOK
Available format(s)

Hardcopy

Language(s)

Japanese

Published date

19-09-2007

1 SCOPE AND DESIGNATION
   1.1 Scope
   1.2 Purpose
   1.3 How is SIR Testing Used?
2 APPLICABLE DOCUMENTS
   2.1 IPC
   2.2 Joint Industry Standards
   2.3 International Electrotechnical Commission (IEC)
   2.4 American Society for Testing and Materials (ASTM)
3 SURFACE INSULATION RESISTANCE
   3.1 Terms and Definitions
        3.1.1 Metal Migration/Filament Formation
        3.1.2 Electrochemical Corrosion
   3.2 Basic Concepts
        3.2.1 Sheet Resistance
        3.2.2 A 'Square'
        3.2.3 Series/Parallel Resistance
        3.2.4 Ohms Per Square
        3.2.5 Conduction Mechanisms
   3.3 Test Factors Affecting Results
        3.3.1 Wiring
        3.3.3 Sample Orientation in the Chamber
        3.3.4 Voltage
        3.3.5 Test Temperature
        3.3.6 Test Humidity
        3.3.7 Rate of Change, Ambient to Elevated
        3.3.8 Test board Design
        3.3.9 Frequency of Measurement
        3.3.10 Conformal Coating
   3.4 Known Process Effects on SIR Levels
        3.4.1 Precleaning
        3.4.2 Developing Process Effects
        3.4.3 Curing Effects
        3.4.4 Hot Air Solder Leveling (HASL)
4 ASSESSMENT OF SIR TEST METHODS
   4.1 Test Methods - General
        4.1.1 Cyclical Test Environments
        4.1.2 Harsh Static Environments
        4.1.3 Measurement Frequency
   4.2 Description of Test Methods
   4.3 Use of Salt Solutions
   4.4 Acceleration Factors
        4.4.1 Arrhenius Model
        4.4.2 Eyring Model
5 SETTING UP FOR SIR TESTING
   5.1 Data Acquisition and Associated Hardware
   5.2 Fixturing
        5.2.1 Fixturing Internal to Chamber
        5.2.2 Fixturing External to Chamber
   5.3 Chamber Design and Configuration
   5.4 System Verification and Calibration
        5.4.1 SIR Test Chamber
        5.4.2 The Data Acquisition System
        5.4.3 Test Supplies
        5.4.4 Power Supplies
6 RUNNING A TEST AND TEST CONSISTENCY
   6.1 Substrate Preparation Important Notes
        6.1.1 Test Specimen Marking
   6.2 Test Specimen Controls
   6.3 Pretest Checks
        6.3.1 Chamber
        6.3.2 Test Specimens
        6.3.3 Sample Randomization and Placement
   6.4 Starting the Test
   6.5 Test Chamber Monitoring
   6.6 Post-Test Operations
   6.7 Data Analysis Example
   6.8 Treatment of 'Anomalous' Data
7 QUALIFICATION PHASES
   7.1 Materials vs. Process Qualification
   7.2 Determining Acceptance Criteria
        7.2.1 Readings Vs. Visual Examination
        7.2.2 Temperature and Humidity Variations
        7.2.3 Discussion of Test Specimen Design
        7.2.4 Available SIR Test Vehicles
8 RECOMMENDATIONS FOR PREVENTION OF SIR FAILURES
   8.1 Typical SIR Failures
   8.2 Contingencies
   8.3 Other Recommendations
9 SIR TESTING ON NONPRINTED BOARD MATERIALS
   9.1 Alternative Substrates
   9.2 Testing Other Printed Board Materials
   9.3 High Resistance Measurements
   9.4 Integrated Circuits (Wafers)
10 REFERENCES
   10.1 Published Papers
   10.2 Industry Contacts and SIR Equipment Vendors
APPENDIX A - LITERATURE REVIEW
APPENDIX B - LISTING OF TEST METHODS AND CRITERIA
APPENDIX C - SIR TEST VEHICLES

Covers the terminology, theories, test procedures and test vehicles of SIR testing, including temperature-humidity (TH) and temperature-humidity-bias (THB).

DevelopmentNote
Included in IPC C 108. (06/2008) Included in IPC C 1000. (07/2008)
DocumentType
Standard
ISBN
978-1-63816-161-5
Pages
86
PublisherName
Institute of Printed Circuits
Status
Current

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IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
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ISO 9455-17:2002 Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
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I.S. EN 61189-5-2:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
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PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
I.S. EN ISO 9455-17:2006 SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES

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