NASA MSFC STD 2907 : 2006

DOCUMENT HISTORY LOG
FOREWORD
1.0 SCOPE
2.0 APPLICABLE DOCUMENTS
3.0 DEFINITIONS
4.0 GENERAL REQUIREMENTS
    4.1 Classification
    4.2 Qualification
    4.3 Deviation and Waiver Requests
    4.4 Quality Management System
    4.5 Materials
         4.5.1 Metal-Clad Laminates
         4.5.2 Bonding Layer (Prepreg)
         4.5.3 Plating or Solder Coating
         4.5.4 Electroless Copper Plating
         4.5.5 Electrolytic Copper Plating
         4.5.6 Tin-Lead Plating
         4.5.7 Solder Coating
         4.5.8 Gold Plating
         4.5.9 Nickel Plating
         4.5.10 Solder Mask
         4.5.11 Marking Ink
         4.5.12 Solvents
    4.6 Quality Conformance Test Circuitry
         4.6.1 Type 1 and Type 2
         4.6.2 Type 3
5.0 DETAILED REQUIREMENTS
    5.1 Dimensions
         5.1.1 Hole Patterns
         5.1.2 Overall
    5.2 Conductor Width and Spacing
    5.3 Measling and Crazing
    5.4 Delamination
    5.5 Undercutting
    5.6 Conductor Outgrowth
    5.7 Bow and Twist
    5.8 Plating Adhesion
    5.9 Dielectric Withstanding Voltage
    5.10 Cleanliness
    5.11 Marking
    5.12 Solder Mask
    5.13 Specific Requirements
         5.13.1 Plating or Coating Thickness
         5.13.2 Annular Ring
    5.14 Specific Requirements
         5.14.1 Plated-Through Hole
         5.14.2 Hole Cleaning and Etchback (Type 3 Only)
         5.14.3 Plating and Coating Thickness
         5.14.4 Annular Ring
         5.14.5 Dielectric Layer Thickness
         5.14.6 Layer-to-Layer Registration
         5.14.7 Thermal Stress
         5.14.8 Hole Solderability
         5.14.9 Rework Solderability
         5.14.10 Circuitry (Type 3 Only)
         5.14.11 Thermal Shock
    5.15 Quality Assurance Provisions
         5.15.1 Responsibility for Inspection
         5.15.2 Test Equipment and Inspection Facilities
         5.15.3 Classifications of Inspection
         5.15.4 Materials Inspection
         5.15.5 Supplier Qualification Inspection
         5.15.6 Quality Conformance Inspection
         5.15.7 Inspection Lot
         5.15.8 Sampling Plan
6.0 NOTES