NF EN 62025-2 : 2005
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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HIGH FREQUENCY INDUCTIVE COMPONENTS - NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 2: TEST METHODS FOR NON-ELECTRICAL CHARACTERISTICS
12-01-2013
11-11-2021
AVANT-PROPOS
1 Domaine d'application
2 Références normatives
3 Termes et définitions
4 Conditions d'essai
4.1 Conditions atmosphériques normales pour les essais
4.2 Conditions d'arbitrage
5 Essais des caractéristiques mécaniques
5.1 Essai de résistance du corps
5.2 Robustesse des sorties (électrodes)
5.3 Soudabilité
5.4 Résistance à la chaleur de soudage
5.5 Résistance à la dissolution de la métallisation
5.6 Vibrations
5.7 Résistance aux chocs
Annexe A (normative) Montage de l'inductance à montage
en surface sur la carte de circuit
imprimé d'essai
Annexe ZA (normative) Références normatives à d'autres
publications internationales avec
les publications européennes
correspondantes
Figure 1 - Méthode pour exercer la pression sur le corps
Figure 2 - Gabarit de mise en pression (gabarit presseur)
Figure 3 - Exemple de carte de circuit imprimé
Figure 4 - Disposition
Figure 5 - Gabarit de mise en pression (gabarit presseur)
Figure 6 - Mise en pression
Figure 7 - Mise en pression et forme de gabarit
Figure 8 - Profil de température de refusion
Tableau 1 - Taille des pastilles de soudure par le code des
inductances miniatures multicouches
Tableau 2 - Epaisseur de la pâte à souder par le code de
taille des inductances
Tableau 3 - Conditions d'immersion dans la soudure
Tableau 4 - Température de refusion
Tableau 5 - Sévérité
Tableau 6 - Température de refusion
Tableau 7 - Conditions de vibrations
Describes the test method for the non-electrical characteristics of the Surface Mounted Device (SMD) inductors to be used for electronic and telecommunication equipment.
| DevelopmentNote |
Indice de classement: C93-371-2 PR NF EN 62025-2 February 2004 (02/2004)
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| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
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| Status |
Superseded
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| SupersededBy |
| Standards | Relationship |
| DIN EN 62025-2:2005-08 | Identical |
| BS EN 62025-2:2005 | Identical |
| NBN EN 62025-2 : 2006 | Identical |
| EN 62025-2:2005 | Identical |
| I.S. EN 62025-2:2005 | Identical |
| IEC 62025-2:2005 | Identical |
| IEC 61188-5-2:2003 | Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 62211:2017 | Inductive components - Reliability management |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| NF EN 60068 2-69 : 2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| NF EN 61190-1-2 : 2014 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| NF EN 62211 : 2004 | INDUCTIVE COMPONENTS - RELIABILITY MANAGEMENT |
| NF EN 60068 2-45 : 1993 AMD 1 1994 | ENVIRONMENTAL TESTING - PART 2: TESTS - TEST XA AND GUIDANCE: IMMERSION IN CLEANING SOLVENTS |
| IEC 60068-2-77:1999 | Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock |
| NF EN 60068-1 : 2014 | ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE |
| NFC 20 720 : 87 AMD 1 1988 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TEST METHODS - TEST T - SOLDERING |
| NF EN 60068 2-6 : 2008 | ENVIRONMENTAL TESTING - PART 2-6: TESTS - TEST FC: VIBRATION (SINUSOIDAL) |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
| NF EN 60068 2-27 : 2009 | ENVIRONMENTAL TESTING - PART 2-27: TESTS - TEST EA AND GUIDANCE: SHOCK |
| NF EN 61188-5-2 : 2004 | PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS |
| NF EN 60068 2-77 : 2001 | ENVIRONMENTAL TESTING - PAT 2-77: TESTS - TEST 77: BODY STRENGTH AND IMPACT SHOCK |
| NF EN 60068-2-21 : 2013 | ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |