08/30190030 DC : 0
Superseded
View Superseded by
BS EN 60191-6-21 ED.1 - MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
Hardcopy , PDF
English
12-31-2010
1 Scope
2 Normative references
3 Definitions
4 Measuring Methods
BS EN 60191-6-21 ED.1
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
17
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
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