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BS EN 60191-6-21:2010

BS EN 60191-6-21:2010

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

12-31-2010

Publisher

British Standards Institution

Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Defines methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Committee
EPL/47
DevelopmentNote
Supersedes 08/30190030 DC. (12/2010)
DocumentType
Standard
Pages
18
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
EN 60191-6-21 : 2010 Identical
IEC 60191-6-21:2010 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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PDF - English
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