12/30271778 DC : 0
Superseded
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BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
Hardcopy , PDF
English
02-28-2015
1 Scope
2 Normative references
3 Terms and definitions
4 General remarks
5 Test apparatus and materials
6 Specimen preparation
7 Temperature cycling test
8 Temperature cycling life
9 Items to be specified in the relevant product
specification
Annex A (informative) - Acceleration of temperature
cycling test for solder joint
Annex B (informative) - Electrical continuity test for
solder joints of package
Annex C (informative) - Reflow solderability test
method for package and test substrate land
Annex D (informative) - Test substrate design
guideline
Annex E (informative) - Heat resistance to reflow
soldering for test substrate
Annex F (informative) - Pull strength measurement
method for test substrate land
Annex G (informative) - Standard mounting process
for the packages
Annex H (informative) - Mechanical stresses to the
packages
BS EN 62137-4 ED.1
| Committee |
EPL/501
|
| DocumentType |
Draft
|
| Pages |
38
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
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