IPC 2225 : 0
Current
The latest, up-to-date edition.
SECTIONAL DESIGN STANDARD FOR ORGANIC MULTICHIP MODULES (MCM-L) AND MCM-L ASSEMBLIES
05-01-1998
1.0 SCOPE
1.1 Purpose
1.2 Documentation Hierarchy
1.3 Presentation
1.4 Interpretation
1.5 Classification of Products
1.6 Terms and Definitions
2.0 APPLICABLE DOCUMENTS
2.1 Institute for Interconnecting and Packaging
Electronic Circuits (IPC)
2.2 Department of Defense
2.3 Other Documents
3.0 GENERAL REQUIREMENTS
3.1 Design Layout
3.2 Test Requirement Considerations
4.0 MATERIALS
4.1 Material Selection
4.2 Dielectric Base Materials (Including
Prepregs and Adhesives)
4.3 Laminate Materials
4.4 Conductive Materials
4.5 Electronic Component Materials (Buried
Resistors and Capacitors)
4.6 Encapsulants, Underfill Materials, and Die
Adhesives
4.7 Markings and Legends
5.0 MECHANICAL/PHYSICAL PROPERTIES
6.0 ELECTRICAL PROPERTIES
7.0 THERMAL MANAGEMENT
7.1 Heat Dissipation Considerations
7.2 Comparison with Ceramic
8.0 COMPONENT AND ASSEMBLY ISSUES
8.1 General Placement Requirements
8.2 Attachment Processes
8.3 Cleaning
8.4 Attachment Inspection
8.5 Electrical Test
8.6 Tape Automated Bonding
9.0 HOLES/INTERCONNECTIONS
9.1 Microvia Fabrication Methods
9.2 Types of Holes
10.0 GENERAL CIRCUIT FEATURE REQUIREMENTS
10.1 Conductor Characteristics
10.2 Land Characteristics
11.0 DOCUMENTATION
11.1 Procurement Documentation Requirements
11.2 Multichip Module (MCM-L) Interconnecting
Structure
11.3 Multichip Module (MCM-L) Construction
11.4 Multichip Module (MCM-L) Materials
and Specifications
11.5 Hole Formation
11.6 Conductor Definition
11.7 Marking
11.8 Processing Conditions
11.9 Special Electrical Performance Requirements
11.10 Configuration and Revision Control
11.11 Parts List(s)
11.12 Assembly Drawing
11.13 Electrical Test Requirements
11.14 Schematic/Logic Diagram
11.16 Automated Documentation Package
12.0 QUALITY ASSURANCE
Figures
Tables
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