AS 1560-1989

1 - AS 1560-1989 GUIDANCE FOR THE MOUNTING OF DISCRETE ELECTRONIC COMPONENTS ON PRINTED BOARDS
4 - PREFACE
5 - CONTENTS
6 - 1. Scope
6 - 2. Introduction
7 - 3. Factors relating to the mounting of components on the board
8 - 4. Factors relating to the over-all dimensions of components
9 - 5. Other factors relating to the component design
11 - 6. External connections to other sections of the equipment
12 - 7. Packing
12 - 8. Soldering, solderability and heat shock
13 - 9. Cleaning
13 - 10. Resistance to protective coatings
14 - APPENDIX A - METHODS OF BENDING, WIRE TERMINATION STIFFNESS TESTS AND INSERTION TEST FOR COMPONENTS
14 - 1. Methods of bending
15 - 2. Tests
15 - 2.1 Wire termination stiffness tests
17 - 2.2 Insertion test for mechanized insertion
18 - APPENDIX B - METHOD OF BENDING FOR SUB-CLAUSE 5.5
19 - APPENDIX C - TOLERANCES FOR EDGE BOARD CONTACTS
19 - 1. Tolerances for edge board contacts for use with closed-end connectors
21 - 2. Tolerances for edge board contacts for use with open-end connectors

Provides guidance to the designer, manufacturer and user of discrete components intended for mounting on printed boards by conventional plain holes or plated-through-hole techniques. Consideration is given to the type of board, dimensions, layout and space requirements for the most effective use of available space and the need for a coherent electronic circuit.

To give guidance to the designer, manufacturer and user of components on matters relating to the specification, design, production, supply and application of components particularly suited for use with printed circuits.Such components will contribute to more efficient and reliable design and manufacture of printed circuit assemblies of compact form. In its present form, this Report is intended to be applied to components which are to be soldered on to printed circuits.