ASTM F 2113 : 2001 : R2011
Withdrawn
Standard Guide for Analysis and Reporting the Impurity Content and Grade of High Purity Metallic Sputtering Targets for Electronic Thin Film Applications (Withdrawn 2020)
English
06-01-2011
01-09-2020
CONTAINED IN VOL. 10.04, 2015 Includes sputtering targets used as thin film source material in fabricating semiconductor electronic devices.
| Committee |
F 01
|
| DocumentType |
Guide
|
| Pages |
2
|
| ProductNote |
Reconfirmed 2011
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Withdrawn
|
| Supersedes |
1.1 This guide covers sputtering targets used as thin film source material in fabricating semiconductor electronic devices. It should be used to develop target specifications for specific materials and should be referenced therein.
1.2 This standard sets purity grade levels, analytical methods and impurity content reporting method and format.
1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.
| ASTM F 3192 : 2016 | Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization (Withdrawn 2023) |
| ASTM F 1593 : 2008 | Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer |
| ASTM F 1593 : 1997 | Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer |
| ASTM F 1593 : 2008 : R2016 | Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum by High Mass-Resolution Glow-Discharge Mass Spectrometer (Withdrawn 2023) |
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