ASTM F 3147 : 2015
Withdrawn
Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend (Withdrawn 2024)
English
07-23-2015
07-23-2015
This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility 1.2A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).
| Committee |
F 01
|
| DocumentType |
Test Method
|
| Pages |
3
|
| PublisherName |
American Society for Testing and Materials
|
| Status |
Withdrawn
|
1.1This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
1.2A completed SMD joint includes; SMD (LED, resistor, etc), PTF ink land (typically silver), conductive adhesive (typically silver), staking compound (non-conductive), and encapsulant (non-conductive).
| ASTM F 3290 : 2017 | Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure (Withdrawn 2023) |
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