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ASTM F 584 : 1987 : R2005

Withdrawn

Withdrawn

View Superseded by

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

Available format(s)

PDF

Language(s)

English

Published date

05-01-2005

Withdrawn date

01-31-2015

Superseded by

ASTM F 584 : 2006

US$83.00
Excluding Tax where applicable

Committee
F 01
DocumentType
Standard Practice
Pages
7
ProductNote
Reconfirmed 2005
PublisherName
American Society for Testing and Materials
Status
Withdrawn
SupersededBy
Supersedes

1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.

1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.

1.3 Photographs (Figs. X1-X1.5 ) are included in Appendix X1 as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.

1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.

1.5 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.

US$83.00
Excluding Tax where applicable