BIS IS/IEC 61558-2-6 : 1ED 2016
Superseded
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 44: NEUTRON BEAM IRRADIATED SINGLE EVENT EFFECT (SEE) TEST METHOD FOR SEMICONDUCTOR DEVICES
08-09-2016
01-08-2024
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure neutron irradiated soft error test
6 Evaluation
7 Summary
Annex A (informative) - Additional information for the
applicable procurement specification
Annex B (informative) - White neutron test apparatus
Annex C (informative) - Failure rate calculation
Bibliography
Defines a procedure for measuring the single event effects (SEEs) on high density integrated circuit semiconductor devices including data retention capability of semiconductor devices with memory when subjected to atmospheric neutron radiation produced by cosmic rays.
| Committee |
TC 47
|
| DevelopmentNote |
Stability Date: 2020. (07/2016)
|
| DocumentType |
Standard
|
| PublisherName |
Bureau of Indian Standards
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| PN EN 60749-44 : 2017 | Identical |
| DIN EN 60749-44:2017-04 | Identical |
| CEI EN 60749-44 : 1ED 2017 | Identical |
| BS EN 60749-44:2016 | Identical |
| NF EN 60749-44 : 2016 | Identical |
| EN 60749-44:2016 | Identical |
| NEN EN IEC 60749-44 : 2016 | Identical |