BS EN 60191-6-12:2002
Withdrawn
View Superseded by
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitch land grid array (FLGA). Rectangular type
Hardcopy , PDF
English
09-24-2002
08-31-2011
| Committee |
EPL/47
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| SupersededBy |
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
| Standards | Relationship |
| IEC 60191-6-12:2002 | Identical |
| I.S. EN 60191-6-12:2002 | Equivalent |
| EN 60191-6-12:2002 | Equivalent |
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