IEC 60191-6-12:2002
Superseded
View Superseded by
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
Hardcopy , PDF
English, Spanish, Castilian
06-14-2002
12-31-2021
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| CEI EN 60191-6-12 : 2002 | Identical |
| BS EN 60191-6-12:2002 | Identical |
| UNE-EN 60191-6-12:2011 | Identical |
| UNE-EN 60191-6-12:2004 | Identical |
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