BS EN 60249-2-13:1994
Withdrawn
Base material for printed circuits. Specifications Flexible copper-clad polyimide film, general purpose grade
Hardcopy , PDF
English
02-28-1990
10-01-2006
National foreword
Committees responsible
Specification
1. Scope
2. Materials and construction
3. Internal marking
4. Electrical properties
5. Non-electrical properties of the copper-clad film
6. Non-electrical properties of the base material
after complete removal of the copper foil
7. Packaging and marking
8. Acceptance testing
9. Additional requirements
Provides requirements for properties of flexible copper clad polyimide film, general purpose grade with optional requirements only by agreement between purchaser and supplier. Copper clad film complying with all the requirements not marked "optional" should be deemed to comply with this specification. Includes internal marking, electrical properties, non-electrical properties of the copper clad film, non-electrical properties of the base material after complete removal of the copper foil, packaging and marking, acceptance testing and additional requirements.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS 4584-102.13(1990) 1994 version incorporates amendment 8421 to BS 4584-102.13(1990) Supersedes 89/22208 DC. Also numbered as IEC 60249-2-13. (09/2003)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| Standards | Relationship |
| DIN EN 60249-2-13:1994-09 | Identical |
| EN 60249-2-13 : 1994 AMD 1 1994 | Identical |
| I.S. EN 60249-2-13:1995 | Identical |
| UNE-EN 60249-2-13:1996 | Identical |
| BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS 123800-003:2001 | System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections |
| BS 123600-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
| BS 4584-103.2:1990 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials |