I.S. EN 60249-2-13:1995
Withdrawn
BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 13: FLEXIBLE COPPER-CLAD POLYIMIDE FILM, GENERAL PURPOSE GRADE
Hardcopy , PDF
English
01-27-1995
06-09-2016
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Foreword
Preface
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad film
6 Non-electrical properties of the base material
after complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
9 Additional requirements
Annex ZA (normative) Other international publications
quoted in this standard with the references of
the relevant European publications
Gives requirements for properties of flexible copper-clad polyamide film, general purpose grade. The specification includes optional requirements which apply only by agreement between purchaser and supplier.
| DocumentType |
Standard
|
| Pages |
46
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 60249-2-13:1987 | Identical |
| DIN EN 60249-2-13:1994-09 | Identical |
| EN 60249-2-13 : 1994 AMD 1 1994 | Identical |
| BS EN 60249-2-13:1994 | Identical |
| UNE-EN 60249-2-13:1996 | Identical |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
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