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BS EN 61190-1-3:2007+A1:2010

Superseded

Superseded

View Superseded by

Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

03-31-2011

Superseded date

03-28-2018

Superseded by

BS EN IEC 61190-1-3:2018

US$400.07
Excluding Tax where applicable

Committee
EPL/501
DocumentType
Standard
Pages
0
PublisherName
British Standards Institution
Status
Superseded
SupersededBy
Supersedes

Standards Relationship
EN 61190-1-3:2007/A1:2010 Identical
CLC/TR 61340-5-2:2008 Identical
IEC 61190-1-3:2007/AMD1:2010 Identical

US$400.07
Excluding Tax where applicable