BS EN 61190-1-3:2002
Withdrawn
View Superseded by
Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Hardcopy , PDF
English
08-12-2002
07-31-2007
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| SupersededBy |
Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).
| Standards | Relationship |
| EN 61190-1-3:2002 | Equivalent |
| I.S. EN 61190-1-3:2002 | Equivalent |
| IEC 61190-1-3:2002 | Identical |
| UNE-EN 61190-1-3:2002 | Equivalent |
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