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IEC 61190-1-3:2002

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

12-31-2021

Language(s)

English - French

Published date

03-22-2002

Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).

Committee
TC 91
DocumentType
Standard
Pages
65
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
UNE-EN 61190-1-3:2007 Identical
UNE-EN 61190-1-3:2002 Identical

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US$273.00
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