IEC 61190-1-3:2002
Superseded
View Superseded by
Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Hardcopy , PDF
English - French
03-22-2002
12-31-2021
Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
65
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| CEI EN 61190-1-3:2003-01 | Identical |
| BS EN 61190-1-3:2002 | Identical |
| UNE-EN 61190-1-3:2007 | Identical |
| UNE-EN 61190-1-3:2002 | Identical |
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