EN 61190-1-3:2002
Withdrawn
Withdrawn
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Published date
06-14-2002
Withdrawn date
06-01-2005
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Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well as for special electronic grade solders. This standard is a quality control document (not intended to relate directly to the material performance in the manufacturing process).
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| CEI EN 61190-1-3:2003-01 | Identical |
| I.S. EN 61190-1-3:2002 | Equivalent |
| BS EN 61190-1-3:2002 | Equivalent |
| UNE-EN 61190-1-3:2002 | Identical |
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