BS EN 61192-3:2003

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
   4.1 Classification
   4.2 Conflict
   4.3 Inspection techniques
   4.4 Interpretation of requirements
5 Component preparation processes
   5.1 Lead forming
   5.2 Lead protrusion and clinching
   5.3 Lead cutting/cropping
   5.4 Pre-tinning
6 Masking attributes
   6.1 Misalignment
   6.2 Improper adhesion
   6.3 Thermal capability
7 Insertion of through-hole components
   7.1 General requirements
   7.2 Orientation and mounting criteria
   7.3 Missing components
   7.4 Wrong components
   7.5 Damaged components
8 Soldering process attributes
   8.1 General requirements
   8.2 Misalignment
   8.3 Damaged components
   8.4 Solder joint characteristics
9 Cleaning attributes
   9.1 Flux residues
   9.2 Other residues
10 Rework/replacement attributes
Annex ZA (normative) Normative references to international
         publications with their corresponding European publications

Provides general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.