EN 61192-2:2003
Withdrawn
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
04-11-2003
04-01-2006
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
4.1 Classification
4.2 Conflict
4.3 Interpretation of requirements
4.4 Antistatic precautions
5 Component preparation processes
6 Solder paste deposition process qualification
6.1 Solder paste characteristics
6.2 Assessment of the process
6.3 Solder paste deposition - Screen and stencil printing
methods - Process control limits
7 Non-conductive adhesive deposition process
7.1 Pot life
7.2 Inter-stage storage and handling
7.3 Adhesive tackiness
7.4 Assessment of the adhesive attachment process
7.5 Adhesive deposition - Syringe dispensing method - Small
components - Process control limits
8 Temporary masking processes
9 Component placement processes
9.1 Assessment of the process
9.2 Discrete components with gull-wing leads
9.3 IC components with flat-ribbon, L- or gull-wing leads on
two sides
9.4 IC components with flat-ribbon, L- or gull-wing leads on
four sides, for example, quad flat packs
9.5 Components with round or flattened (coined) leads
9.6 IC component packages with J-leads on two and four sides,
for example, SOJ, PLCC
9.7 Leadless rectangular components with metallized
terminations
9.8 Components with cylindrical endcap terminations
9.9 Bottom-only terminations on leadless components
9.10 Leadless chip carriers with castellated terminations
9.11 Components with butt leads
9.12 Components with inward L-shaped ribbon leads
9.13 Flat-lug leads on power dissipating components
10 Post-placement rework
10.1 Rework of components placed on solder paste
10.2 Rework of components placed on non-conductive adhesive
11 Adhesive curing
12 Soldering processes
13 Cleaning processes
14 Hand placement and hand soldering, including hand
rework/repair
15 Electrical test
Annex A (normative)
A.1 Introduction
A.2 Example solder fillets and alignment: flat-ribbon, L- and
gull-wing leads
A.3 Example solder fillets and alignment: round or flattened
(coined) leads
A.4 Example solder fillets and alignment: J-leads
A.5 Example solder fillets and alignment: rectangular or
square end leadless components
A.6 Example solder fillets and alignment: cylindrical end cap
terminations, for example, MELFs
A.7 Example solder fillets and alignment: bottom-only
terminations on leadless components
A.8 Example solder fillets and alignment: leadless chip
carriers with castellated terminations
A.9 Example solder fillets and alignment: butt joints
A.10 Example solder fillets and alignment: inward L-shaped
flat ribbon leads
A.11 Example solder fillets and alignment: flat-lug leads on
power dissipating components
Figures
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
| Committee |
CLC/SR 91
|
| DevelopmentNote |
To be used in conjunction with EN 61192-1, EN 61192-3 & EN 61192-4 (07/2003)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. EN 61192-2:2003 | Identical |
| BS EN 61192-2:2003 | Identical |
| NF EN 61192-2 : 2003 | Identical |
| PN EN 61192-2 : 2006 | Identical |
| NEN EN IEC 61192-2 : 2003 | Identical |
| IEC 61192-2:2003 | Identical |
| NBN EN 61192-2 : 2004 | Identical |
| CEI EN 61192-2 : 2004 | Identical |
| DIN EN 61192-2:2003-11 | Identical |
| UNE-EN 61192-2:2003 | Identical |
| I.S. EN 61192-3:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES |
| EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| BS EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| EN 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| IEC 61193-1:2001 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| EN 61192-4:2003 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| EN 61193-1:2002 | Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies |
| IEC 61192-4:2002 | Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies |
| EN ISO 9002:1994/AC:1997 | QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION |
| EN 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| ISO 9002:1994 | Quality systems — Model for quality assurance in production, installation and servicing |
| EN 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
| EN ISO 9001:2015 | Quality management systems - Requirements (ISO 9001:2015) |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| ISO 9001:2015 | Quality management systems — Requirements |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| IEC 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| EN 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 61191-4:2017 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |