BS EN IEC 61189-2-804:2023
Current
Test methods for electrical materials, printed board and other interconnection structures and assemblies Test methods for time to delamination. T260, T288, T300
Hardcopy , PDF
English
12-25-2023
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
| Standards | Relationship |
| IEC 61189-2-804:2023 | Identical |
| EN IEC 61189-2-804:2023 | Identical |
| UNE-EN IEC 61189-2-804:2023 | Equivalent |
| I.S. EN IEC 61189-2-804:2023 | Equivalent |
| IEC 61189-2-804:2023 | Equivalent |
| EN IEC 61189-2-804:2023 | Equivalent |
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