IEC 61189-2-804:2023
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
08-25-2023
IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
Important note : All end users must be registered with an Account prior to user licenses being assigned.Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.