BS EN ISO 9453:2020
Current
Soft solder alloys. Chemical compositions and forms
Hardcopy , PDF
English
10-13-2020
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
| Standards | Relationship |
| EN ISO 9453:2020 | Equivalent |
| ISO 9453:2020 | Equivalent |
| I.S. EN ISO 9453:2020 | Equivalent |
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