ISO 9453:2020
Current
Soft solder alloys — Chemical compositions and forms
Hardcopy , PDF
English, French
09-24-2020
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
| Committee |
ISO/TC 44/SC 12
|
| DocumentType |
Standard
|
| Pages |
13
|
| PublisherName |
International Organization for Standardization
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NS-EN ISO 9453:2020 | Identical |
| DIN EN ISO 9453:2021-01 | Identical |
| ÖNORM EN ISO 9453:2021 04 01 | Identical |
| PN-EN ISO 9453:2021-04 | Identical |
| I.S. EN ISO 9453:2020 | Identical |
| BS EN ISO 9453:2020 | Equivalent |
| NF EN ISO 9453:2020 | Identical |
| UNE-EN ISO 9453:2021 | Identical |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.