ISO 9453:2014
Withdrawn
Withdrawn
View Superseded by
Soft solder alloys — Chemical compositions and forms
Available format(s)
Hardcopy , PDF
Language(s)
French, English, Russian
Published date
08-18-2014
Withdrawn date
04-09-2025
Superseded by
US$96.00
Excluding Tax where applicable
ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
| Committee |
ISO/TC 44/SC 12
|
| DevelopmentNote |
Supersedes ISO/DIS 9453. (08/2014)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| DIN EN ISO 9453:2014-12 | Identical |
| NBN EN ISO 9453 : 2014 | Identical |
| NEN EN ISO 9453 : 2014 | Identical |
| NS EN ISO 9453 : 2014 | Identical |
| I.S. EN ISO 9453:2014 | Identical |
| PN EN ISO 9453 : 2014 | Identical |
| SS-EN ISO 9453 : 2014 | Identical |
| BS EN ISO 9453:2014 | Identical |
| EN ISO 9453:2014 | Identical |
| NF EN ISO 9453 : 2014 | Identical |
| I.S. EN 29453:1994 | Identical |
| UNE-EN ISO 9453:2015 | Identical |
| UNE-EN 29453:1996 | Identical |
| NEN ISO 9453 : 1994 | Identical |
| NS ISO 9453 : 1ED 1994 | Identical |
| EN 29453 : 1993 | Identical |
| DIN EN 29453:1994-02 | Corresponds |
| 05/30133283 DC : DRAFT MAY 2005 | IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| 10/30227098 DC : 0 | BS EN 16125 - LPG EQUIPMENT AND ACCESSORIES - PIPEWORK SYSTEMS AND SUPPORTS - LPG LIQUID PHASE AND VAPOUR PRESSURE PHASE |
| PREN ISO 9455-16 : DRAFT 2011 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
| BS EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies General |
| BS PD ISO/IEC PAS 60127-8 : 2014 | MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
| 16/30334455 DC : 0 | BS EN ISO 9455-13 - SOFT SOLDERING FLUXES - TEST METHODS - PART 13: DETERMINATION OF FLUX SPATTERING |
| BS EN 61190-1-1:2002 | Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| CEI EN 60068-2-21 : 2006 | ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
| I.S. 820:2010 | NON-DOMESTIC GAS INSTALLATIONS |
| I.S. EN ISO 9455-14:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017) |
| I.S. EN 60068-2-69:2017 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| I.S. EN 61192-1:2003 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL |
| BS EN 60068-2-21:2006 | Environmental testing Tests. Test U: Robustness of terminations and integral mounting devices |
| EN ISO 9455-13:2017 | Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering (ISO 9455-13:2017) |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| I.S. EN ISO 9455-16:2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
| I.S. EN ISO 9455-10:2012 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012) |
| BS EN ISO 12224-1:1998 | Solder wire, solid and flux cored. Specification and test methods Classification and performance requirements |
| IEC 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| BS EN ISO 12224-2:1999 | Solder wire, solid and flux cored. Specification and test methods Determination of flux content |
| 14/30309696 DC : 0 | BS EN 60068-2-69 ED 3.0 - ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD |
| BS EN ISO 9455-16:2013 | Soft soldering fluxes. Test methods Flux efficacy test, wetting balance method |
| I.S. EN 13148:2010 | COPPER AND COPPER ALLOYS - HOT-DIP TINNED STRIP |
| EN 61189-11:2013 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
| BS 6915(2001) : 2001 | DESIGN AND CONSTRUCTION OF FULLY SUPPORTED LEAD SHEET ROOF AND WALL COVERINGS - CODE OF PRACTICE |
| EN 60851-4:2016 | Winding wires - Test methods - Part 4: Chemical properties |
| EN 60127-4:2005/A2:2013 | Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types |
| EN 62878-1-1:2015 | Device embedded substrate - Part 1-1: Generic specification - Test methods |
| IPC J STD 006 CHINESE : B-2 | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| BS EN 62326-20:2016 | Printed boards Printed circuit boards for high-brightness LEDs |
| BS EN 61189-11:2013 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys |
| ISO 9455-13:2017 | Soft soldering fluxes — Test methods — Part 13: Determination of flux spattering |
| 14/30302429 DC : 0 | BS EN 60851-4 - WINDING WIRES - METHODS OF TEST FOR WINDING WIRES - PART 4: CHEMICAL PROPERTIES |
| BS EN 16602-70-08:2015 | Space product assurance. Manual soldering of high-reliability electrical connections |
| BS EN ISO 9455-15:2017 | Soft soldering fluxes. Test methods Copper corrosion test |
| BS EN 62024-1:2008 | High frequency inductive components. Electrical characteristics and measuring methods Nanohenry range chip inductor |
| 07/30160659 DC : 0 | BS EN 62024-1 - HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR |
| EN ISO 9455-14:2017 | Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017) |
| IEC 62024-1:2017 | High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor |
| IEC 61190-1-3:2017 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
| BS EN 60127-4 : 2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES |
| I.S. EN 61192-5:2007 | WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES |
| VDE 0468-2-69 : 2018 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| I.S. EN 61190-1-3:2007 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| DIN EN ISO 9455-10:2013-01 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| DIN EN ISO 9455-16:2013-08 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD (ISO 9455-16:2013) |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| BS 9251:2005 | Sprinkler systems for residential and domestic occupancies. Code of practice |
| BS EN 13148:2010 | Copper and copper alloys. Hot-dip tinned strip |
| DIN EN 1775:2007-10 | Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations |
| DIN EN 13148:2010-12 | Copper and copper alloys - Hot-dip tinned strip |
| I.S. EN 1775:2007 | GAS SUPPLY - GAS PIPEWORK FOR BUILDINGS - MAXIMUM OPERATING PRESSURE LESS THAN OR EQUAL TO 5 BAR - FUNCTIONAL RECOMMENDATIONS |
| BS 6400:1997 | Specification for installation of domestic sized gas meters (2nd and 3rd family gases) |
| BS 6700(2006) : 2006 | DESIGN, INSTALLATION, TESTING AND MAINTENANCE OF SERVICES SUPPLYING WATER FOR DOMESTIC USE WITHIN BUILDINGS AND THEIR CURTILAGES - SPECIFICATION |
| BS EN ISO 9455-13:2017 | Soft soldering fluxes. Test methods Determination of flux spattering |
| 15/30318681 DC : 0 | BS EN 61190-1-3 ED 3.0 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| 14/30312344 DC : 0 | PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
| 16/30337155 DC : 0 | BS EN ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES |
| 09/30208696 DC : 0 | BS EN 61189-11 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE AND MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
| 02/709371 DC : DRAFT JULY 2002 | EN 50390 - SPACE PRODUCT ASSURANCE - THE MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS |
| 07/19990369 DC : 0 | BS EN 806-4 - SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4 - INSTALLATION |
| BS EN 806-4:2010 | Specifications for installations inside buildings conveying water for human consumption Installation |
| 16/30338234 DC : 0 | BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION |
| EN IEC 62024-1:2018 | High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor |
| EN 60068-2-69:2017/AC:2018-03 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018) |
| BS EN 61190-1-3 : 2007 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| PREN ISO 9455-10 : DRAFT 2011 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| I.S. EN 61189-3:2008 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
| ISO 7195:2005 | Nuclear energy — Packaging of uranium hexafluoride (UF6) for transport |
| IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV | Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types |
| BS EN ISO 9455-17:2006 | Soft soldering fluxes. Test methods Surface insulation resistance comb test and electrochemical migration test of flux residues |
| BS EN 60851-4:1998 | Winding Wires. Test methods Chemical properties |
| DIN EN 806-4:2010-06 | Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation |
| 09/30190431 DC : 0 | BS EN 61190-1-3 ED.2 A1 - AMENDMENT 1 TO IEC 61190-1-3, ED.2: ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| BS EN ISO 9455-14:2017 | Soft soldering fluxes. Test methods Assessment of tackiness of flux residues |
| I.S. EN 60851-4:2016 | WINDING WIRES - TEST METHODS - PART 4: CHEMICAL PROPERTIES |
| 05/30133287 DC : DRAFT MAY 2005 | IEC 61190-1-3 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| I.S. EN ISO 9455-15:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017) |
| I.S. EN ISO 9455-13:2017 | SOFT SOLDERING FLUXES - TEST METHODS - PART 13: DETERMINATION OF FLUX SPATTERING (ISO 9455-13:2017) |
| EN IEC 61190-1-3:2018 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications |
| NF EN 61190-1-3 : 2008 AMD 1 2010 | Fastening materials for electronic assemblies - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solders for electronic soldering applications |
| DIN EN 60068-2-69 : 2007 | ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017) |
| I.S. EN 806-4:2010 | SPECIFICATIONS FOR INSTALLATIONS INSIDE BUILDINGS CONVEYING WATER FOR HUMAN CONSUMPTION - PART 4: INSTALLATION |
| ISO 9455-14:2017 | Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues |
| I.S. EN 62878-1-1:2015 | DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
| BS EN 29455-14:1993 | Soft soldering fluxes. Test methods Assessment of tackiness of flux residues |
| BS EN 50390:2004 | Space product assurance. The manual soldering of high-reliability electrical connections |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| ONORM EN ISO 9455-16 : 2013 | SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TESTS, WETTING BALANCE METHOD (ISO 9455-16:2013) |
| IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| ISO 9455-17:2002 | Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues |
| IEC 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| ISO 9455-10:2012 | Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method |
| IEC 61189-11:2013 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
| BS EN ISO 9455-10:2012 | Soft soldering fluxes. Test methods Flux efficacy test, solder spread method |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| EN 1775:2007 | Gas supply - Gas pipework for buildings - Maximum operating pressure less than or equal to 5 bar - Functional recommendations |
| EN ISO 12224-1:1998 | Solder wire, solid and flux cored - Specification and test methods - Part 1: Classification and performance requirements (ISO 12224-1:1997) |
| EN 29455-14:1993 | Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:1991) |
| EN ISO 9455-10:2012 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| EN 806-4:2010 | Specifications for installations inside buildings conveying water for human consumption - Part 4: Installation |
| EN 611-2:1996 | Tin and tin alloys - Pewter and pewterware - Part 2: Pewterware |
| EN ISO 9455-17:2006 | Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2002) |
| EN ISO 9455-16:2013 | Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
| EN 16602-70-08:2015 | Space product assurance - Manual soldering of high-reliability electrical connections |
| I.S. EN IEC 62024-1:2018 | HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR |
| BS EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) |
| BS EN 61192-5:2007 | Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies |
| 16/30337159 DC : 0 | BS EN ISO 9455-15 - SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST |
| BS ISO 9455-17 : 2002 AMD 16425 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| I.S. EN 61189-11:2013 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV)) |
| 02/703607 DC : DRAFT FEB 2002 | ISO/DIS 7195 - NUCLEAR ENERGY - PACKAGING OF URANIUM HEXAFLUORIDE (UF6) FOR TRANSPORT |
| 12/30258438 DC : 0 | BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY |
| BS EN 60068-2-69:2017 | Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| 11/30213136 DC : 0 | BS EN ISO 9455-16 - SOFT SOLDERING FLUXES - TEST METHODS - PART 16: FLUX EFFICACY TEST, WETTING BALANCE METHOD |
| 11/30234673 DC : 0 | BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| BS EN 62878-1-1:2015 | Device embedded substrate Generic specification. Test methods |
| I.S. EN 16602-70-08:2015 | SPACE PRODUCT ASSURANCE - MANUAL SOLDERING OF HIGH-RELIABILITY ELECTRICAL CONNECTIONS |
| I.S. EN 60127-4:2005 | MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV)) |
| I.S. EN 62024-1:2008 | HIGH FREQUENCY INDUCTIVE COMPONENTS - ELECTRICAL CHARACTERISTICS AND MEASURING METHODS - PART 1: NANOHENRY RANGE CHIP INDUCTOR |
| I.S. EN 62326-20:2016 | PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
| I.S. EN 60068-2-21:2006 | ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
| EN ISO 9455-15:2017 | Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:2017) |
| IEC 60851-4:2016 | Winding wires - Test methods - Part 4: Chemical properties |
| ISO 9455-15:2017 | Soft soldering fluxes — Test methods — Part 15: Copper corrosion test |
| I.S. EN 61190-1-1:2002 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
| DIN EN ISO 12224-1:1998-10 | Solder wire, solid and flux cored - Specification and test method - Part 1: Classification and performance requirements (ISO 12224-1:1997) |
| BS EN 1775:2007 | Gas supply. Gas pipework for buildings. Maximum operating pressure less than or equal to 5 bar. Functional recommendations |
| ISO 9455-16:2013 | Soft soldering fluxes — Test methods — Part 16: Flux efficacy test, wetting balance method |
| EN 61192-5:2007 | Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
| EN 13148:2010 | Copper and copper alloys - Hot-dip tinned strip |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 62326-20:2016 | Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
| EN 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| UNE-EN ISO 9455-10:2012 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| UNE-EN ISO 9455-14:2018 | Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017) |
| UNE-EN ISO 9455-13:2018 | Soft soldering fluxes - Test methods - Part 13: Determination of flux spattering (ISO 9455-13:2017) |
| UNE-EN 60851-4:2017 | Winding wires - Test methods - Part 4: Chemical properties |
| UNE-EN ISO 9455-16:2013 | Soft soldering fluxes - Test methods - Part 16: Flux efficacy test, wetting balance method (ISO 9455-16:2013) |
| I.S. EN ISO 9455-17:2006 | SOFT SOLDERING FLUXES - TEST METHODS - PART 17: SURFACE INSULATION RESISTANCE COMB TEST AND ELECTROCHEMICAL MIGRATION TEST OF FLUX RESIDUES |
| I.S. EN ISO 12224-1:1999 | SOLDER WIRE, SOLID AND FLUX CORED - SPECIFICATION AND TEST METHODS - CLASSIFICATION AND PERFORMANCE REQUIREMENTS |
| I.S. EN IEC 61190-1-3:2018 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| ISO 3677:2016 | Filler metal for soldering and brazing — Designation |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
Summarise
US$96.00
Excluding Tax where applicable
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