ISO 9453:2014
Withdrawn
View Superseded by
Soft solder alloys — Chemical compositions and forms
Hardcopy , PDF
French, English, Russian
08-18-2014
04-09-2025
ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
| Committee |
ISO/TC 44/SC 12
|
| DevelopmentNote |
Supersedes ISO/DIS 9453. (08/2014)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| DIN EN ISO 9453:2014-12 | Identical |
| NBN EN ISO 9453 : 2014 | Identical |
| NEN EN ISO 9453 : 2014 | Identical |
| NS EN ISO 9453 : 2014 | Identical |
| I.S. EN ISO 9453:2014 | Identical |
| PN EN ISO 9453 : 2014 | Identical |
| SS-EN ISO 9453 : 2014 | Identical |
| BS EN ISO 9453:2014 | Identical |
| EN ISO 9453:2014 | Identical |
| NF EN ISO 9453 : 2014 | Identical |
| I.S. EN 29453:1994 | Identical |
| UNE-EN ISO 9453:2015 | Identical |
| UNE-EN 29453:1996 | Identical |
| NEN ISO 9453 : 1994 | Identical |
| NS ISO 9453 : 1ED 1994 | Identical |
| EN 29453 : 1993 | Identical |
| DIN EN 29453:1994-02 | Corresponds |
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