ISO 9453:2006
Withdrawn
View Superseded by
Soft solder alloys — Chemical compositions and forms
Hardcopy , PDF
English, French
09-22-2006
04-09-2025
ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
- tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
- tin-antimony;
- tin-bismuth;
- tin-copper, with and without silver;
- tin-indium, with and without silver and bismuth;
- tin-silver, with and without copper and bismuth;
- tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.
| Committee |
ISO/TC 44/SC 12
|
| DocumentType |
Standard
|
| Pages |
10
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| I.S. EN ISO 9453:2006 | Equivalent |
| DIN EN ISO 9453:2006-12 | Equivalent |
| BS EN ISO 9453:2006 | Equivalent |
| UNE-EN ISO 9453:2007 | Identical |
| BS EN ISO 9453:2006 | Identical |
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