EN ISO 9453:2014
Superseded
View Superseded by
Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
08-06-2014
10-21-2020
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) - Comparison between alloy numbers
in ISO 9453 and short names and chemical
compositions according to IEC 61190-1-3
Annex B (informative) - Patented alloys and patent holder list
Bibliography
ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
| Committee |
CEN/TC 121
|
| DevelopmentNote |
Supersedes EN 29453. (11/2006) Supersedes PREN ISO 9453. (09/2014)
|
| DocumentType |
Standard
|
| PublisherName |
Comite Europeen de Normalisation
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| DIN EN ISO 9453:2014-12 | Identical |
| ISO 9453:2014 | Identical |
| NBN EN ISO 9453 : 2014 | Identical |
| NEN EN ISO 9453 : 2014 | Identical |
| NS EN ISO 9453 : 2014 | Identical |
| I.S. EN ISO 9453:2014 | Identical |
| PN EN ISO 9453 : 2014 | Identical |
| SS-EN ISO 9453 : 2014 | Identical |
| BS EN ISO 9453:2014 | Identical |
| NF EN ISO 9453 : 2014 | Identical |
| UNE-EN ISO 9453:2015 | Identical |