ISO 9455-16:2013
Withdrawn
Withdrawn
View Superseded by
Soft soldering fluxes — Test methods — Part 16: Flux efficacy test, wetting balance method
Available format(s)
Hardcopy , PDF
Language(s)
French, English
Published date
04-12-2013
Withdrawn date
04-09-2025
Superseded by
US$96.00
Excluding Tax where applicable
ISO 9455-16:2013 specifies a method for the assessment of the efficacy of a soft soldering flux, known as the wetting balance method. It gives a qualitative assessment of the comparative efficacy of two fluxes (for example, a standard and a test flux), based on their capacity to promote wetting of a metal surface by liquid solder. The method is applicable to all flux types in liquid form classified in ISO 9454‑1.
| Committee |
ISO/TC 44/SC 12
|
| DevelopmentNote |
Supersedes ISO/DIS 9455-16. (04/2013)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| ONORM EN ISO 9455-16 : 2013 | Identical |
| NBN EN ISO 9455-16 : 2013 | Identical |
| NEN EN ISO 9455-16 : 2013 | Identical |
| NS EN ISO 9455-16 : 2013 | Identical |
| I.S. EN ISO 9455-16:2013 | Identical |
| PN EN ISO 9455-16 : 2013 | Identical |
| BS EN ISO 9455-16:2013 | Identical |
| EN ISO 9455-16:2013 | Identical |
| NF EN ISO 9455-16 : 2013 | Identical |
| DIN EN ISO 9455-16:2013-08 | Identical |
| UNE-EN ISO 9455-16:2013 | Identical |
| BS EN ISO 9454-1:2016 | Soft soldering fluxes. Classification and requirements Classification, labelling and packaging |
| BS EN 61190-1-1:2002 | Attachment materials for electronic assembly Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| I.S. EN ISO 9455-10:2012 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD (ISO 9455-10:2012) |
| ISO 9454-1:2016 | Soft soldering fluxes — Classification and requirements — Part 1: Classification, labelling and packaging |
| BS EN ISO 9454-2:2001 | Soft soldering fluxes. Classification and requirements Performance requirements |
| DIN EN ISO 9455-10:2013-01 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| I.S. EN ISO 9454-2:2000 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
| 14/30285529 DC : 0 | BS EN ISO 9454-1 - SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING |
| DIN EN ISO 9454-1:2016-07 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016) |
| I.S. EN ISO 9454-1:2016 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016) |
| PREN ISO 9455-10 : DRAFT 2011 | SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| EN ISO 9454-2:2000 | Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998) |
| DIN EN ISO 9455-2:1995-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| ISO 12224-3:2003 | Solder wire, solid and flux cored — Specifications and test methods — Part 3: Wetting balance test method for flux cored solder wire efficacy |
| BS EN ISO 12224-3:2003 | Solder wire, solid and flux cored. Specification and test methods Wetting balance test method for flux core solder wire efficacy |
| ISO 9455-10:2012 | Soft soldering fluxes — Test methods — Part 10: Flux efficacy test, solder spread method |
| NF EN ISO 9454-2 : 2000 | SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS |
| BS EN ISO 9455-10:2012 | Soft soldering fluxes. Test methods Flux efficacy test, solder spread method |
| EN ISO 9455-10:2012 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| EN ISO 9454-1:2016 | Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016) |
| EN ISO 12224-3:2003 | Solder wire, solid and flux cored - Specifications and tests methods - Part 3: Wetting balance test method for flux core solder wire efficacy (ISO 12224-3:2003) |
| 11/30234673 DC : 0 | BS EN ISO 9455-10 - SOFT SOLDERING FLUXES - TEST METHODS - PART 10: FLUX EFFICACY TEST, SOLDER SPREAD METHOD |
| I.S. EN 61190-1-1:2002 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY |
| DIN EN ISO 12224-3:2003-10 | Solder wire, solid and flux cored - Specifications and test methods - Part 3: Wetting balance test method for flux cored solder wire efficacy (ISO 12224-3:2003) |
| BS EN 29454-1:1994 | Soft soldering fluxes. Classification and requirements Classification, labelling and packaging |
| DIN EN ISO 9455-12:1994-11 | SOFT SOLDERING FLUXES - TEST METHODS - PART 12: STEEL TUBE CORROSION TEST |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| UNE-EN ISO 9454-1:2016 | Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016) |
| UNE-EN ISO 9455-10:2012 | Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 9454-1:2016 | Soft soldering fluxes — Classification and requirements — Part 1: Classification, labelling and packaging |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| ISO 9453:2014 | Soft solder alloys — Chemical compositions and forms |
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US$96.00
Excluding Tax where applicable
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