NF EN ISO 9453:2020
Current
Current
Soft solder alloys — Chemical compositions and forms
Published date
10-01-2020
Publisher
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This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
| Committee |
ISO/TC 44
|
| DocumentType |
Standard
|
| PublisherName |
Association Francaise de Normalisation
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN ISO 9453:2020 | Identical |
| ISO 9453:2020 | Identical |
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