CEI EN 60191-6-20 : 2011
Current
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-20: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE J-LEAD PACKAGES (SOJ)
Hardcopy , PDF
English
11-01-2011
FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Measuring methods
Annex ZA (normative) - Normative references
to international publications with their
corresponding European publications
This part of IEC 60191 specifies methods to measure package dimensions of small outline J lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-78. (12/2011)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-20:2010 | Identical |
| IEC 60191-6-20:2010 | Identical |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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