IEC 60191-6-20:2010
Current
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English, English - French
Published date
08-30-2010
Publisher
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods
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