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CEI EN 60191-6-6 : 2002

CEI EN 60191-6-6 : 2002

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The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE PITCH LAND GRID ARRAY (FLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2002

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) - Normative references to
         international publications with their corresponding
         European publications

Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Committee
CT 309
DevelopmentNote
Classificazione CEI 47-1006. (07/2015)
DocumentType
Standard
Pages
20
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
IEC 60191-6-6:2001 Identical
EN 60191-6-6:2001 Identical

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Hardcopy - English
PDF - English
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