IEC 60191-6-6:2001
Current
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
Hardcopy , PDF
English, English - French
03-22-2001
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
3.1 flanged type
3.2 type of real chip size
3.3 FLGA
3.4 material designation
3.4.1 plastic type (P-FLGA)
3.4.2 ceramic type (C-FLGA)
IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Also numbered as BS EN 60191-6-6. (09/2001) A Bilingual edition has been published. (01/2013) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NBN EN 60191 6-6 : 2002 | Identical |
| NEN EN IEC 60191-6-6 : 2001 | Identical |
| I.S. EN 60191-6-6:2001 | Identical |
| PN EN 60191-6-6 : 2002 | Identical |
| CEI EN 60191-6-6 : 2002 | Identical |
| EN 60191-6-6:2001 | Identical |
| DIN EN 60191-6-6:2002-02 | Identical |
| NF EN 60191-6-6 : 2002 | Identical |
| UNE-EN 60191-6-6:2002 | Identical |
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