CEI EN 60749-20-1 : 2010
Superseded
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
Hardcopy , PDF
English
01-01-2010
05-16-2026
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General applicability and
reliability considerations
5 Dry packing
6 Drying
7 Use
Annex A (normative) - Symbol
and labels for
moisture-sensitive
devices
Annex B (informative) - Board
rework
Annex C (informative) - Derating
due to factory environmental
conditions
Bibliography
Defines to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-66. (09/2010)
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 60749-20-1:2009 | Identical |
| EN 60749-20-1:2009 | Identical |
A newer version of this standard is available.
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