CEI EN IEC 60749-20-1:2026
Current
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Hardcopy , PDF
English
04-01-2026
This part of IEC 60749 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other moisture-sensitive devices made with moisture-permeable materials (epoxies, silicones, etc.) that are exposed to the ambient air.
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-7043-1
|
| Pages |
48
|
| ProductNote |
This standard is also refers to IPC/JEDEC J-STD-033C
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60749-20-1:2019 | Identical |
| EN IEC 60749-20-1:2026 | Identical |
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