CEI EN 61190-1-2 : 2008
Superseded
Superseded
View Superseded by
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-01-2008
Publisher
Superseded date
09-06-2025
Superseded by
US$83.94
Excluding Tax where applicable
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
Summarise
US$83.94
Excluding Tax where applicable
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