CEI EN 61190-1-2:2003-05
Superseded
Superseded
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Fastening Materials for Electronic Assemblies Part 1-2: Fluxed Solder Paste Requirements for High-Quality Interconnects in Electronic Component Assembly
Published date
05-01-2003
Publisher
Superseded date
09-06-2025
Superseded by
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This International Standard is part of the IEC 61190 series and defines the characteristics of solder pastes, specifying properties, test methods and inspection criteria.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 61190-1-2:2002 | Identical |
| EN 61190-1-2:2002 | Identical |
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