CEI EN 61190-1-2:2003-05
Superseded
Superseded
View Superseded by
Fastening Materials for Electronic Assemblies Part 1-2: Fluxed Solder Paste Requirements for High-Quality Interconnects in Electronic Component Assembly
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
05-01-2003
Publisher
Superseded date
09-06-2025
Superseded by
Excluding Tax where applicable
This International Standard is part of the IEC 61190 series and defines the characteristics of solder pastes, specifying properties, test methods and inspection criteria.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 61190-1-2:2002 | Identical |
| EN 61190-1-2:2002 | Identical |
Summarise