IEC 61190-1-2:2002
Superseded
View Superseded by
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
Hardcopy , PDF
English - French
03-22-2002
12-31-2021
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
| DocumentType |
Standard
|
| Pages |
35
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| CEI EN 61190-1-2:2003-05 | Identical |
| UNE-EN 61190-1-2:2002 | Identical |
| BS EN 61190-1-2:2002 | Identical |
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