BS EN 61190-1-2:2002
Superseded
View Superseded by
Attachment materials for electronic assembly Requirements for solder pastes for high-quality interconnections in electronic assembly
Hardcopy , PDF
English
08-12-2002
01-17-2016
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
| Standards | Relationship |
| IEC 61190-1-2:2002 | Identical |
| EN 61190-1-2:2002 | Equivalent |
| I.S. EN 61190-1-2:2002 | Equivalent |
| UNE-EN 61190-1-2:2002 | Equivalent |
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