EN 61190-1-2:2002
Withdrawn
Withdrawn
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
Published date
06-14-2002
Withdrawn date
06-01-2005
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Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| BS EN 61190-1-2:2002 | Equivalent |
| CEI EN 61190-1-2:2003-05 | Identical |
| I.S. EN 61190-1-2:2002 | Equivalent |
| UNE-EN 61190-1-2:2002 | Identical |
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