BS EN 61190-1-2:2007
Superseded
View Superseded by
Attachment materials for electronic assembly Requirements for soldering pastes for high-quality interconnects in electronics assembly
Hardcopy , PDF
English
07-31-2007
06-30-2014
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material\'s performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
| Standards | Relationship |
| EN 60191-4:1999/A1:2002 | Identical |
| IEC 61190-1-2:2007 | Identical |
| EN 61190-1-2:2007 | Identical |
| I.S. EN 61190-1-2:2007 | Equivalent |
| UNE-EN 61190-1-2:2007 | Equivalent |
| EN 61190-1-2:2007 | Equivalent |
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