EN 61190-1-2:2007
Withdrawn
Withdrawn
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published date
06-28-2007
Withdrawn date
05-01-2010
Sorry this product is not available in your region.
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| I.S. EN 61190-1-2:2007 | Equivalent |
| BS EN 61190-1-2:2007 | Equivalent |
| UNE-EN 61190-1-2:2007 | Identical |
| BS EN 61190-1-2:2007 | Identical |
| CEI EN IEC 60127-8:2018-11 | Miniature Fuses Part 8: Fuse Resistors with Overcurrent Protection |
Summarise
Sorry this product is not available in your region.