CEI EN 62047-15 : 2016
Withdrawn
View Superseded by
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 15: TEST METHOD OF BONDING STRENGTH BETWEEN PDMS AND GLASS
Hardcopy , PDF
English
01-01-2016
05-16-2019
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Testing method
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Specifies test method for bonding strength between poly dimethyl siloxane (PDMS) and glass.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-125. (08/2017)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC 62047-15:2015 | Identical |
| EN 62047-15:2015 | Identical |
| IEC 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
| EN 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
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