DD IEC/PAS 62137-3:2008
Superseded
View Superseded by
Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
Hardcopy , PDF
English
01-31-2009
03-31-2012
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.