BS EN 62137:2004

1 Scope
2 Normative references
3 Terms and definitions
4 Abbreviations
5 Solder joint quality test methods
   5.1 Reflow solderability test for solder joint
   5.2 Reserved for future use
6 Mechanical test methods
   6.1 Bending test for solder joint
   6.2 Drop test for solder joint
7 Environment test methods
   7.1 Temperature cycling test for solder joint
   7.2 Reserved for future use
Annex A (informative) Informative test methods for test
                      board - Guidance
Annex B (informative) Standard mounting process for area
                      array type packages and peripheral
                      terminal type packages (QFN and SON)
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications
Bibliography
Figures
Tables

Defines the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages.