I.S. EN 62137:2005
Superseded
View Superseded by
ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
Hardcopy , PDF
English
01-01-2005
03-04-2015
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Abbreviations
5 Solder joint quality test methods
5.1 Reflow solderability test for solder joint
5.2 Reserved for future use
6 Mechanical test methods
6.1 Bending test for solder joint
6.2 Drop test for solder joint
7 Environment test methods
7.1 Temperature cycling test for solder joint
7.2 Reserved for future use
Annex A (informative) Informative test methods for test board -
Guidance
Annex B (informative) Standard mounting process for area array type
packages and peripheral terminal type packages
(QFN and SON)
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Figures
Tables
Defines the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages.
| DocumentType |
Standard
|
| Pages |
72
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 62137:2004 | Identical |
| DIN EN 62137:2005-04 | Identical |
| NBN EN 62137 : 2005 | Identical |
| NF EN 62137 : 2005 | Identical |
| BS EN 62137:2004 | Identical |
| EN 62137:2004/corrigendum:2005 | Identical |
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