IEC 62137:2004

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Abbreviations
5 Solder joint quality test methods
   5.1 Reflow solderability test for solder joint
   5.2 Reserved for future use
6 Mechanical test methods
   6.1 Bending test for solder joint
   6.2 Drop test for solder joint
7 Environment test methods
   7.1 Temperature cycling test for solder joint
   7.2 Reserved for future use
Annex A (informative) Informative test methods for
                      test board - Guidance
Annex B (informative) Standard mounting process for area
                      array type packages and peripheral
                      terminal type packages (QFN and SON)
Bibliography

This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.